TAIPEI (Taiwan News) – Semiconductor tool maker All-Ring Tech is receiving major orders for its equipment from Taiwanese chipmakers as they seek to expand their advanced packaging capabilities.
All-Ring Tech has secured orders from companies including Taiwan Semiconductor Manufacturing Co. (TSMC) and ASE Technology, DigiTimes reported Wednesday (May 18). Sources told the outlet that All-Ring has sent equipment for TSMC’s chip-to-wafer-to-substrate packaging and integrated output lines to the chipmaker’s facilities in Taichung and Longtan.
The toolmaker has also received orders to supply TSMC’s new advanced packaging plant in Chunan, where the world’s largest contract chipmaker intends to prepare its 3D system on embedded chip technology (SoIC ) for commercial production in the second half of this year, the sources said. DigiTimes.
According to the report, All-Ring also provides equipment such as flip-chip bead array packaging tools to ASE Technology and other outsourced semiconductor assembly and test companies.
The OEM declined to comment on specific orders and customers, but told the outlet that advanced packaging equipment accounted for 40% of its total chipmaking equipment sales in the first quarter of 2022. Heavy equipment sales helped All-Ring reach NT. $629 million ($21.12 million), representing a 9.7% year-over-year growth.
The company added that it expects revenue to peak in the fourth quarter. All-Ring Tech is headquartered in Kaohsiung and mainly focuses on manufacturing equipment for semiconductor, passive component and LED manufacturing processes.